How to optimize heat dissipation from the PCB

For improved heat management, openings in the solder mask are designed under components that generate significant heat on the opposite side, along with a substantial number of thermal vias. The board shown is flat-mounted on the heat sink, with power amplifier ICs and output filter components fitting into heat sink cavities, and the rest is pressed against the heat sink using a thin thermally conductive foil.

Pcb how to - heat dissipation
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