High Density Interconnect PCBs Production

Kejie Circuits possesses extensive experience in manufacturing HDI PCBs, leveraging a factory base with profound expertise in producing HDI PCBs for diverse market applications.

HDI Pcb capabilities:

Min. Line space :0.1mm
Min. Line width :0.1mm
Min. hole size :0.1mm
Final Finishing : ENIG

Example of Application : Suitable for main board of mobile phone

All HDI Pcbs are meticulously manufactured under rigorous quality supervision at our Bomin PCB facility.

What is a High Density Interconnect (HDI) Pcb?

IPC-2226 delineates HDI as a printed circuit board with a greater wiring density per unit area compared to conventional PCBs. HDI boards feature finer lines and spaces (≤ 100 µm / 0.10mm), smaller vias (<150 µm), capture pads <400 µm / 0.40mm, and a higher connection pad density (>20 pads/cm2) than what is typically utilized in conventional PCB technology.

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