HDI PCB Manufacturing
Kejie provides HDI PCB manufacturing services for advanced electronic products requiring high circuit density, fine traces, microvias and compact board designs. Our engineering and manufacturing teams support HDI PCB projects from prototype development through volume production.
Microvias • Fine Line Technology • HDI PCB • ENIG Finish • Prototype & Production
HDI PCB Technical Capabilities
| Capability | Specification |
|---|---|
| Minimum Line Width | 0.10 mm |
| Minimum Line Space | 0.10 mm |
| Minimum Hole Size | 0.10 mm |
| Microvias | Supported |
| Blind Vias | Supported |
| Buried Vias | Supported |
| Capability | Specification |
|---|---|
| Surface Finish | Supported |
| Fine Pitch Components | Supported |
| BGA Routing | Supported |
| High Density Layouts | Supported |
| Prototype Production | Supported |
| Volume Production | Supported |
What Makes HDI PCB Technology Different?
HDI (High Density Interconnect) PCBs are designed to achieve higher routing density than conventional printed circuit boards. By using microvias, finer traces, smaller pads and advanced layer interconnections, HDI technology allows engineers to reduce board size while increasing functionality and signal performance.
HDI PCB technology is commonly used in compact electronic products where space is limited and component density is high, including mobile devices, communication equipment, medical electronics and advanced industrial systems.
Major HDI PCB Applications
Smartphones & Mobile Devices
HDI PCBs are widely used in smartphones, tablets and other portable electronic devices where board space is limited.
Industrial Control Systems
Industrial automation and control equipment benefit from HDI technology when high circuit density is required.
Computing & Embedded Systems
HDI PCBs are commonly used in embedded computing platforms, processors and high-performance electronic assemblies.
Why Choose Kejie for HDI PCB Manufacturing?
Kejie supports HDI PCB projects requiring fine line technology, microvias, blind vias and high-density circuit layouts. Our engineering and manufacturing teams work with customers throughout the development process, from prototype validation to volume production.
HDI PCB manufacturing requires precise process control, advanced fabrication capabilities and consistent quality standards. Kejie supports customers developing compact, high-performance electronic products where reliability, manufacturing consistency and technical expertise are critical.
Whether your project involves telecommunications equipment, medical electronics, industrial systems or next-generation consumer devices, our team is ready to assist with your HDI PCB manufacturing requirements.