HDI PCB Manufacturing
Kejie PCB is an experienced HDI PCB manufacturer producing high density interconnect boards for compact, high-performance electronics. Our HDI manufacturing capability supports microvia technology, blind and buried vias, fine-pitch BGA routing and sequential lamination — with every project manually reviewed by our CAM engineers before production starts.
Microvias • Fine Line Technology • HDI PCB • ENIG Finish • Prototype & Production
What Is an HDI PCB?
A High Density Interconnect (HDI) PCB achieves greater wiring density per unit area than conventional PCBs by using smaller vias, finer trace widths and higher connection pad density. This allows more functionality to be packed into a smaller board footprint — making HDI the preferred choice for smartphones, medical devices, aerospace electronics and any application where size, weight and signal performance matter.
HDI boards are defined by IPC-2226 as boards featuring:
Trace width and spacing ≤ 0.10mm (100 µm)
Microvia diameter < 0.15mm (150 µm)
Capture pad diameter < 0.40mm (400 µm)
Connection pad density > 20 pads/cm²
HDI Build-Up Structures We Support
Kejie PCB manufactures HDI boards across all standard build-up configurations:
| Structure | Description | Typical Use |
|---|---|---|
| 1+N+1 | One microvia layer each side | Entry-level HDI, mobile devices |
| 2+N+2 | Two sequential microvia layers | Mid-range HDI, tablets, IoT |
| 3+N+3 | Three sequential microvia layers | Advanced HDI, high-performance computing |
| Any Layer HDI | Microvias on every layer | Maximum density, flagship smartphones |
| Stacked Microvias | Microvias stacked vertically | Fine-pitch BGA, high-speed signal routing |
| Staggered Microvias | Microvias offset between layers | Improved reliability, easier manufacturing |
HDI PCB Manufacturing Capabilities
| Capability | Specification |
|---|---|
| Minimum Line Width | 0.10 mm |
| Minimum Line Space | 0.10 mm |
| Minimum Hole Size | 0.10 mm |
| Microvias | Supported |
| Blind Vias | Supported |
| Buried Vias | Supported |
| Capability | Specification |
|---|---|
| Surface Finish | Supported |
| Fine Pitch Components | Supported |
| BGA Routing | Supported |
| High Density Layouts | Supported |
| Prototype Production | Supported |
| Volume Production | Supported |
Materials for HDI PCB Manufacturing
HDI boards require materials with tight dimensional stability and low signal loss to perform reliably at high layer counts and fine geometries. Kejie PCB works with:
- High Tg FR4 — standard choice for most HDI applications, offering improved thermal stability
- Low Dk/Df FR4 — for signal-sensitive designs requiring reduced dielectric loss
- Megtron 6 / Megtron 7 — Panasonic materials for high-speed, low-loss HDI applications
- Isola I-Tera M40 — ultra-low loss laminate for demanding signal integrity requirements
- Halogen-free options — for RoHS-compliant and environmentally sensitive applications
Our primary material suppliers include Shengyi, EMC, Isola and Panasonic.
What Makes HDI PCB Technology Different?
HDI (High Density Interconnect) PCBs are designed to achieve higher routing density than conventional printed circuit boards. By using microvias, finer traces, smaller pads and advanced layer interconnections, HDI technology allows engineers to reduce board size while increasing functionality and signal performance.
HDI PCB technology is commonly used in compact electronic products where space is limited and component density is high, including mobile devices, communication equipment, medical electronics and advanced industrial systems.
Major HDI PCB Applications
Smartphones & Mobile Devices
HDI PCBs are widely used in smartphones, tablets and other portable electronic devices where board space is limited.
Industrial Control Systems
Industrial automation and control equipment benefit from HDI technology when high circuit density is required.
Computing & Embedded Systems
HDI PCBs are commonly used in embedded computing platforms, processors and high-performance electronic assemblies.
Why Engineers Choose Kejie as Their HDI PCB Manufacturer
Design Confidentiality — your Gerber files remain private and are permanently deleted after two years of inactivity
Manual CAM review — every HDI project is reviewed by our engineering team before production, catching microvia aspect ratio violations, registration issues and stack-up errors before they reach the floor
Free DFM Review — we review your design for manufacturability at no extra cost, including microvia design rules and blind/buried via feasibility
Sequential lamination expertise — our facility supports multi-lamination cycles required for 2+N+2 and higher build-up structures
Direct engineer access — speak directly with our HDI engineering team throughout your project
HDI vs Standard PCB — When Do You Need HDI?
HDI is the right choice when:
- Your design includes fine-pitch BGA components with pitch < 0.8mm
- You need to reduce board size without reducing functionality
- Your design has signal integrity requirements that standard vias cannot meet
- Your layer count exceeds what standard through-hole via technology can accommodate efficiently
For designs that don’t require microvia technology, our Rigid PCB manufacturing service supports standard multilayer boards up to 48 layers. For designs combining HDI with flexible sections, see our Rigid-Flex PCB page.
For RF and microwave designs requiring controlled impedance on Rogers materials, see our High Frequency PCB manufacturing page