PCB Testing Services
Effective PCB testing is essential to verify the quality, reliability and performance of electronic products before delivery.
Testing Methods We Support
With over 25 years of PCB manufacturing and assembly experience, we provide comprehensive PCB testing services and inspection programs. Based on your design requirements, application environment and production goals, we determine the most appropriate testing methods to ensure quality, reliability and performance.
In-Circuit Testing
In-Circuit Testing verifies component placement, electrical connections and manufacturing defects using dedicated test fixtures. It is widely used in medium and high-volume PCB assembly production.
Automated Optical Inspection
AOI uses high-resolution cameras to detect soldering defects, missing components, polarity errors and assembly issues before products move to final testing.
Functional Testing
Certain customers prefer a traditional functional test to ensure their product’s functionality. This meFunctional testing verifies that the assembled PCB performs as intended under real operating conditions and application requirements.
Other Functional Testings
Additional PCB assembly testing options include:
- Solderability testing verifies that PCB pads and component leads can form reliable solder joints during the assembly process.
- PCB contamination testing: Contamination testing detects ionic residues and surface contaminants that may affect electrical performance, reliability and long-term product stability.
- Micro-sectioning analysis: Microsection analysis examines the internal structure of a PCB to verify layer alignment, plating quality, hole integrity and manufacturing consistency.
- Time-domain reflectometer (TDR): TDR testing measures controlled impedance and signal integrity by identifying impedance variations along PCB traces and transmission lines.
- Peel testing: it evaluates the adhesion strength between copper foil and the PCB substrate to verify mechanical durability and manufacturing quality.
- Solder float testing: it evaluates the thermal resistance of PCB materials and plated holes by exposing samples to molten solder under controlled conditions.
Flying Probe Testing
Flying Probe Testing uses movable test probes to verify electrical connections and circuit integrity without requiring dedicated fixtures. It is ideal for prototypes and low-volume production.
Burn-in Testing
Burn-in testing subjects assemblies to elevated temperatures and operating conditions to identify early-life failures and improve long-term reliability.
X-Ray Inspection
AXI uses X-ray imaging to inspect hidden solder joints, BGA connections and internal PCB structures that cannot be evaluated through visual inspection.
Visual Inspection
Visual inspection is used to identify obvious manufacturing defects such as soldering issues, damaged components, incorrect polarity and assembly errors.
