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Flex Rigid PCB
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Flex Rigid PCB
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Flex Rigid PCB
Kejie PCB operates several complete in house Fabrication, and Assembly printed circuit board manufacturing plant capable to take your application from concept to production. We can work with numerous data formats without comprising quality.
Our engineers are experienced in wide variety of flexible printed circuit boards, rigid flex circuit design and assemblies and are diverse enough to take on any challenge. Kejie PCB has gained excellent reputation for outstanding work in Flex printed circuit board manufacturing for industries such as Aerospace, Consumer Electronics, Opto Electronics, Medical, Industrial controls, Semiconductor, Test & Measurements, Wireless Networks, and Military sectors.
Whether your circuit needs are for flat flexible cable, flexible printed circuits boards, rigid flex circuits, rigid flex circuits or other. We think we have the capability to meet your needs. We offer value added services that will assist you with bringing your flexible circuit design into reality.
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Flexible PCB
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Flex Rigid PCB
Some technical details below:

|
Item
|
Technical Capacity |
Mass Production (MP) |
Sample |
Types of Products |
HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, and FPC |
HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,FPC, Teflon Board, and HDI |
Material |
FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3 |
FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon |
layers |
2-12 Layers |
2-14 Layers |
Conductor Width/ Space of the Inner Layer |
4/4mil |
4/3mil or 3/4mil |
Conductor Width/ Space of the Outlayer Layer |
4/4mil |
4/3mil or 3/4mil |
Board Width of the Inner Layer |
0.1-1.6mm |
0.075-1.6mm |
Hole Diameter |
0.2mm |
0.15mm |
Ratio of Depth against Diameter |
8:1 |
10:1 |
Maximum Dimension |
630*530mm |
630*530mm |
Interior Copper Width |
18-140um |
18-210um |
Exterior Copper Width |
12-210um |
12-210um |
Minimum Width of the Welding Ring |
0.13mm |
0.10mm |
Minimum Width of Bridge with Solder Mask |
0.08mm |
0.05mm |
Minimum Solder Resist Window |
0.05mm |
0.03mm |
Tolerance of Solder Resistance |
±10% |
±8% |
Board Thickness |
0.25mm~3.4mm |
0.25mm~3.4mm |
Outline Process Precision |
±0.1mm |
±0.08mm |
Surface Treatment |
HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger |
HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger, Immersion Gold + OSP |
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