Rigid PCB

Rigid Printed Circuit Board

Product: Single-sided, Double-sided, Multilayer
Material:
 Fr4, Cem-1, CEM-3, Epoxy Resin CCL, isola
Thickness: 0.16~3.0mm
Thickness of Copper Conductor: 18μm /35μm /70μm
Process Capability: HASL, Ni/Au Plating, Immersion Silver, ENIG
Minimum Trace Width: 0.10mm
Minimum Wire Spacing:0.10mm
Minimum Drilling Diameter:Φ0.20mm
Monthly Capacity: 20,000㎡
Application:Aerospace, Sound System, Computer, Medical Equipment, LED Lighting, etc.

pcb111
Characteristic:
Al-bas
Application:
Power supply, Power amplifier, relay, LED, etc.
pcb1112
Characteristic:
8 layer blind / buried via PCB, PTFE-FR4 mixed.
Application:
Power amplifier etc.
pcb11123
Characteristic:
6-12 layer blind / buried via PCB, thickness 5mm.
Application:
Secondary power source etc.
pcb111234
Characteristic:
16 layer impedance control PC
Application:
Telecommunication, Network, Medical equipment etc.
product8
QFP Immersion Gold with Connector
product7
JBL SMT Multilayer PCB
product6
JBL SMT Multilayer PCB
product5
QFP ENIG finishing PCB
product4
QFP BGA Gold plate finishing 14 Layers
product3
QFP OSP Multilayer PCB
product2
QFP Immersion Gold with Connector
product1
Lead Free HASL Multilayer PCB

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