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| Item |
Technical Capacity |
| Mass Production (MP) |
Sample |
| Types of Products |
HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, and FPC |
HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB，FPC, Teflon Board, and HDI |
| Material |
FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3 |
FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon |
| layers |
2-12 Layers |
2-14 Layers |
| Conductor Width/ Space of the Inner Layer |
4/4mil |
4/3mil or 3/4mil |
| Conductor Width/ Space of the Outlayer Layer |
4/4mil |
4/3mil或3/4mil |
| Board Width of the Inner Layer |
0.1-1.6mm |
0.075-1.6mm |
| Hole Diameter |
0.2mm |
0.15mm |
| Ratio of Depth against Diameter |
8:1 |
10:1 |
| Maximum Dimension |
630*530mm |
630*530mm |
| Interior Copper Width |
18-140um |
18-210um |
| Exterior Copper Width |
12-210um |
12-210um |
| Minimum Width of the Welding Ring |
0.13mm |
0.10mm |
| Minimum Width of Bridge with Solder Mask |
0.08mm |
0.05mm |
| Minimum Solder Resist Window |
0.05mm |
0.03mm |
| Tolerance of Solder Resistance |
±10% |
±8% |
| Board Thickness |
0.25mm～3.4mm |
0.25mm～3.4mm |
| Outline Process Precision |
±0.1mm |
±0.08mm |
| Surface Treatment |
HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger |
HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger, Immersion Gold + OSP |
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