| | Item | Technical Capacity | | Mass Production (MP) | Sample | | Types of Products | HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, and FPC | HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB，FPC, Teflon Board, and HDI | | Material | FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3 | FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon | | layers | 2-12 Layers | 2-14 Layers | | Conductor Width/ Space of the Inner Layer | 4/4mil | 4/3mil or 3/4mil | | Conductor Width/ Space of the Outlayer Layer | 4/4mil | 4/3mil或3/4mil | | Board Width of the Inner Layer | 0.1-1.6mm | 0.075-1.6mm | | Hole Diameter | 0.2mm | 0.15mm | | Ratio of Depth against Diameter | 8:1 | 10:1 | | Maximum Dimension | 630*530mm | 630*530mm | | Interior Copper Width | 18-140um | 18-210um | | Exterior Copper Width | 12-210um | 12-210um | | Minimum Width of the Welding Ring | 0.13mm | 0.10mm | | Minimum Width of Bridge with Solder Mask | 0.08mm | 0.05mm | | Minimum Solder Resist Window | 0.05mm | 0.03mm | | Tolerance of Solder Resistance | ±10% | ±8% | | Board Thickness | 0.25mm～3.4mm | 0.25mm～3.4mm | | Outline Process Precision | ±0.1mm | ±0.08mm | | Surface Treatment | HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger | HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger, Immersion Gold + OSP |
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