Kejie Pcb’s major PCB Equipment
Production Capacity
Layer Counts: 1-14
Material: FR-4, High TG FR-4, PTFE, Aluminum Base, Rogers.
Maximum Size: 500mmX600mm
Board Outline Tolerance: ±0.13 mm
Board Thickness: 0.20mm—6.00mm
Thickness Tolerance (t=0.8mm): ±8%
Thickness Tolerance (t<0.8mm): ±10%
Insulation Layer Thickness: 0.075mm—5.00mm
Minimum Line: 0.2mm
Minimum Space: 0.2mm
Out-layer Copper Thickness: 35µm—175µm
In-layer Copper Thickness: 17µm-175µm
Drilling Hole (Mechanical): 0.15mm—6.35mm
Finish Hole (Mechanical): 0.15mm—6.30mm
Diameter Tolerance (Mechanical): 0.05mm
Registration (Mechanical): 0.075mm
Aspect Ratio: 8:1
Solder Mask Type: Ink
SMT Mini. Solder Mask Width: 0.08mm
Mini Solder Mask Clearance: 0.05mm
Plug Hole Diameter; 0.25mm—0. 60mm
Impedance Control Tolerance: ±10%
Surface Finish: HASL, ENIG, Chem, Tin, Flash Gold, OSP, Gold finger
2.
Application : Telecommunication, Network, Industrial control, Medical equipment, PC& periphery
3.
1) Characteristic: 0.5mm CSP
Blind & Buried Hole
Application : Blue tooth
2) Characteristic: up to 12 layer, Tg170℃
0.8mm BGA
±10% Impendance control
Application: Telecommunication, Network, Medical equipment, etc
3) Characteristic: Al-Base
Application: Power supply, Power Amplifier, relay, LED,etc
4) Characteristic: Up to 16 layer, Blind & Buried hole
Heavy copper 950z), Up to 6.0 mm board thickness
Application: Secondary Power source