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Flex Rigid Pcb

Kejie PCB operates several complete in house Fabrication, and Assembly printed circuit board manufacturing plant capable to take your application from concept to production. We can work with numerous data formats without comprising quality.

Our engineers are experienced in wide variety of flexible printed circuit boards, rigid flex circuit design and assemblies and are diverse enough to take on any challenge. Kejie PCB has gained excellent reputation for outstanding work in Flex printed circuit board manufacturing for industries such as Aerospace, Consumer Electronics, Opto Electronics, Medical, Industrial controls, Semiconductor, Test & Measurements, Wireless Networks, and Military sectors.

Whether your circuit needs are for flat flexible cable, flexible printed circuits boards, rigid flex circuits, rigid flex circuits or other. We think we have the capability to meet your needs. We offer value added services that will assist you with bringing your flexible circuit design into reality.

Some technical details below:

Item

Technical Capacity
Mass Production (MP) Sample
Types of Products HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, and FPC HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,FPC, Teflon Board, and HDI
Material FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3 FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon
layers 2-12 Layers 2-14 Layers
Conductor Width/ Space of the Inner Layer 4/4mil 4/3mil or 3/4mil
Conductor Width/ Space of the Outlayer Layer 4/4mil 4/3mil或3/4mil
Board Width of the Inner Layer 0.1-1.6mm 0.075-1.6mm
Hole Diameter 0.2mm 0.15mm
Ratio of Depth against Diameter 8:1 10:1
Maximum Dimension 630*530mm 630*530mm
Interior Copper Width 18-140um 18-210um
Exterior Copper Width 12-210um 12-210um
Minimum Width of the Welding Ring 0.13mm 0.10mm
Minimum Width of Bridge with Solder Mask 0.08mm 0.05mm
Minimum Solder Resist Window 0.05mm 0.03mm
Tolerance of Solder Resistance ±10% ±8%
Board Thickness 0.25mm~3.4mm 0.25mm~3.4mm
Outline Process Precision ±0.1mm ±0.08mm
Surface Treatment HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger, Immersion Gold + OSP

 

 

 

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