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Range of Flexible pcb solution
Flexible PCB Flexible printed circuits (FPC) is made of flexible dielectric base material and main material is Polyimide CCL, which is pressed with cover film with mechanical protection and good dielectric properties. FPC is also classified by SS, DS and ML. DS&ML get a conductivity by metallization. Advantages of FPC: easily flex and fold, freely arrange by the lay-out to get the integrity of component assembly and conductor. It would be easy for the transportation, assembly, connection, etc. Therefore, FPC is widely used in aviation, military, mobile communication, IT product, Industrial equipment, etc.
1) Application territory for flexible PCB(FPC) 1. mobile phone, battery of mobile phone, communication equipment. 2. IT product such as notebook, computer and attachment, PDA 3. Video product such as CD-Rom, VCD, DVD 4. Office automation machine such as printer, fax machine, and copying machine. 5. Advanced camera and digital camera 6. Industrial equipment such as medical machine, control-circuits, automobile appearance. 7. Aerospace and aviation
2) Major production equipments - CNC Drilling machine - Optical target hole machine - High energy exposuring machine - Eteching machine - Punching machine - Small lamination machine - Lamination machine - Automatic silk-screen machine - Electronic plating line - Chemical immersion Au line
3)Mayor testing equipment - Bending endurance tester - Flexural endurance tester - Projection magnify tester - Peel strength test machine - Microscope - Florescent X-ray coating thickness gange - CCD magnify tester 
FPC PRODUCTION CAPACITY | | | Item | Content | Specification | | 1 | Layer | 1~2 ( 85% of Excellent Products with 3-6 Layers) | | 2 | Dimension of Finished Board (Utmost) | 250* 400mm | | 3 | Board Ply (maximum) | 0.4mm | | 4 | Board Ply ( minimum ) | 0.05mm | | 5 | Tolerance of Thickness of Finished Product (0.075mm Board Ply < 0.4mm ) | ± 0.03mm | | 6 | Hole Diameter ( minimum ) | 0.20mm | | 7 | Diameter of Finished Hole ( minimum ) | 0.25mm | | 8 | Thickness of Base Copper( minimum ) | 1/ 3oz | | 9 | Thickness of Base Copper ( maximum ) | 1oz | | 10 | Dielectric Thickness ( minimum ) | 1/2mil | | 11 | Dielectric Thickness ( maximum ) | 3mil | | 12 | Material | PI/ PET | | 13 | Hole Plating Aspect Ratio ( maximum ) | 7:1 | | 14 | Hole Diameter Tolerance ( PTH ) | ± 0.050mm | | 15 | Hole Diameter Tolerance ( non-PTH ) | ± 0.050mm | | 16 | Hole Position Tolerance( Compared with CAD ) | ± 0.076mm | | 17 | PTH Wall Thickness | ≥0.015mm | | 18 | Designed Conductor Width/ Space (Minimum) | 1/2oz 4mil/4mil 1/3oz 3mil/3mil ( 0.076mm / 0.076mm ) | | 19 | Tolerance of Line Width | ± 20%( normal ) | | 20 | Solder Mask Thickness ( minimum ) | 7.6um (line angle) | | 21 | Thickness and Tolerance of Nickel Plated Gold Finger | 2.54um~~5um | | 22 | Thickness and Tolerance of Gold- Plated Gold Finger | 0.025um ~~0.2um | | 23 | Thickness of Immersion Nickel/ Gold (Minimum- Maximum) | 2.54um~5um/0.025um~0.1um | | 24 | Tolerance of Punch Hole Diameter | ± 0.05mm | | 25 | Outline Tolerance (Fine Steel Mould) | ± 2mil( ± 0.05mm ) | | 26 | Outline Tolerance (Steel Mould) | ± 4mil( ± 0.1mm ) | | 27 | Outline Tolerance (Knife Mould) | ± 12mil( ± 0.3mm ) | | 28 | Impedance Tolerance of Finished Board (Minimum) | ± 10% | | Others | Item | Content | | 1 | Circumference Void Test Voltage | 200 ± 5V | | 2 | Short-Circuited Resistance | 10M Ω | | 3 | Open-Circuited Resistance | 30 Ω | | 4 | Solderability Test | 260 ± 10 ℃ , Time: 10Sec | | Note: | | |