Flexible printed circuits (FPC)

Range of Flexible pcb solution

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Flexible PCB
Flexible printed circuits (FPC) is made of flexible dielectric base material and main material is Polyimide CCL, which is pressed with cover film with mechanical protection and good dielectric properties. FPC is also classified by SS, DS and ML.  DS&ML get a conductivity by metallization.
Advantages of FPC: easily flex and fold, freely arrange by the lay-out to get the integrity of component assembly and conductor. It would be easy for the transportation, assembly, connection, etc. Therefore, FPC is widely used in aviation, military, mobile communication, IT product, Industrial equipment, etc.

1) Application territory for flexible PCB(FPC)
1.    mobile phone, battery of mobile phone, communication equipment.
2.    IT product such as notebook, computer and attachment, PDA
3.    Video product such as CD-Rom, VCD, DVD
4.    Office automation machine such as printer, fax machine, and copying machine.
5.    Advanced camera and digital camera
6.    Industrial equipment such as medical machine, control-circuits, automobile appearance.
7.    Aerospace and aviation

2) Major production equipments
- CNC Drilling machine
- Optical target hole machine
- High energy exposuring machine
- Eteching machine
- Punching machine
- Small lamination machine
- Lamination machine
- Automatic silk-screen machine
- Electronic plating line
- Chemical immersion Au line

3)Mayor testing equipment
- Bending endurance tester
- Flexural endurance tester
- Projection magnify tester
- Peel strength test machine
- Microscope
- Florescent X-ray coating thickness gange
- CCD magnify tester

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FPC PRODUCTION CAPACITY 

 

 

Item

Content

Specification

1

Layer

12 ( 85% of Excellent Products with 3-6 Layers)

2

Dimension of Finished Board (Utmost)

250* 400mm

3

Board Ply (maximum)

0.4mm

4

Board Ply ( minimum )

0.05mm

5

Tolerance of Thickness of Finished Product (0.075mm Board Ply < 0.4mm )

± 0.03mm

6

Hole Diameter ( minimum )

0.20mm

7

Diameter of Finished Hole ( minimum )

0.25mm

8

Thickness of Base Copper( minimum )

1/ 3oz

9

Thickness of Base Copper ( maximum )

1oz

10

Dielectric Thickness ( minimum )

 1/2mil

11

Dielectric Thickness ( maximum )

 3mil

12

Material

PI/ PET

13

Hole Plating Aspect Ratio ( maximum )

7:1

14

Hole Diameter Tolerance ( PTH )

± 0.050mm

15

Hole Diameter Tolerance ( non-PTH )

± 0.050mm

16

Hole Position Tolerance( Compared with CAD )

± 0.076mm

17

PTH Wall Thickness

≥0.015mm

18

Designed Conductor Width/ Space (Minimum)

1/2oz 4mil/4mil
1/3oz 3mil/3mil
( 0.076mm / 0.076mm )

19

Tolerance of Line Width

± 20%( normal )

20

Solder Mask Thickness ( minimum )

7.6um line angle

21

Thickness and Tolerance of Nickel Plated Gold Finger

2.54um~~5um

22

Thickness and Tolerance of Gold- Plated Gold Finger

0.025um ~~0.2um

23

Thickness of Immersion Nickel/ Gold (Minimum- Maximum)

2.54um~5um/0.025um~0.1um

24

Tolerance of Punch Hole Diameter

± 0.05mm

25

Outline Tolerance (Fine Steel Mould)

± 2mil( ± 0.05mm )

26

Outline Tolerance (Steel Mould)

± 4mil( ± 0.1mm )

27

Outline Tolerance (Knife Mould)

± 12mil( ± 0.3mm )

28

Impedance Tolerance of Finished Board (Minimum)

± 10%

Others

Item

Content

1

Circumference Void Test Voltage

200 ± 5V

2

Short-Circuited Resistance

10M Ω

3

Open-Circuited Resistance

30 Ω

4

Solderability Test

260 ± 10 , Time: 10Sec

Note