Item

Technical Capacity

Mass Production (MP)

Sample

Types of Products

HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, and FPC

HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB，FPC, Teflon Board, and HDI

Material

FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3

FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon

layers

2-12 Layers

2-14 Layers

Conductor Width/ Space of the Inner Layer

4/4mil

4/3mil or 3/4mil

Conductor Width/ Space of the Outlayer Layer

4/4mil

4/3mil或3/4mil

Board Width of the Inner Layer

0.1-1.6mm

0.075-1.6mm

Hole Diameter

0.2mm

0.15mm

Ratio of Depth against Diameter

8:1

10:1

Maximum Dimension

630*530mm

630*530mm

Interior Copper Width

18-140um

18-210um

Exterior Copper Width

12-210um

12-210um

Minimum Width of the Welding Ring

0.13mm

0.10mm

Minimum Width of Bridge with Solder Mask

0.08mm

0.05mm

Minimum Solder Resist Window

0.05mm

0.03mm

Tolerance of Solder Resistance

±10%

±8%

Board Thickness

0.25mm～3.4mm

0.25mm～3.4mm

Outline Process Precision

±0.1mm

±0.08mm

Surface Treatment

HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger

HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger, Immersion Gold + OSP