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Flex-Rigid Pcb

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Flex-Rigid Pcb

Flex-Rigid Pcb

Item Technical Capacity
Mass Production (MP) Sample
Types of Products HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, and FPC HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,FPC, Teflon Board, and HDI
Material FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3 FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon
layers 2-12 Layers 2-14 Layers
Conductor Width/ Space of the Inner Layer 4/4mil 4/3mil or 3/4mil
Conductor Width/ Space of the Outlayer Layer 4/4mil 4/3mil或3/4mil
Board Width of the Inner Layer 0.1-1.6mm 0.075-1.6mm
Hole Diameter 0.2mm 0.15mm
Ratio of Depth against Diameter 8:1 10:1
Maximum Dimension 630*530mm 630*530mm
Interior Copper Width 18-140um 18-210um
Exterior Copper Width 12-210um 12-210um
Minimum Width of the Welding Ring 0.13mm 0.10mm
Minimum Width of Bridge with Solder Mask 0.08mm 0.05mm
Minimum Solder Resist Window 0.05mm 0.03mm
Tolerance of Solder Resistance ±10% ±8%
Board Thickness 0.25mm~3.4mm 0.25mm~3.4mm
Outline Process Precision ±0.1mm ±0.08mm
Surface Treatment HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger, Immersion Gold + OSP