Equipment

Major Equipment  I

Name Original QTY
CNC Drilling machine(total 138 spindles) Germany 10
Japan 9
China 7
CNC Routing machine(total 22 spindles) Taiwan 5
Shenzhen 1
Scrubbing machine/Cleaning machine Taiwan 3
Hong Kong 12
Desmear & PTH line Hong Kong 2
Automation plating (Gold) line Hong Kong 1
Automation plating (Tin) line Hong Kong 3
Automation panel plating line Hong Kong 2
S/M Developing line Hong Kong 2
D/F Developing line Hong Kong 2
AOI systems USA 5
Exposure machine(5KW) Japan, Taiwan 7
Exposure machine(7KW/8KW) Japan, Taiwan 7
Inner layer DES line Taiwan, Hong Kong 2
Outer Etching & Stripping line Hong Kong 2
Micro-section meter Japan 1
X-Ray machine USA 1
Planar test system Taiwan 1
IR Hong Kong 1
Lonic contamination test machine France 1

Major Equipment  II

Name Original QTY
Screening machine Hong Kong, Taiwan 29
HAL machine Taiwan 1
Automatic ENIG line Hong Kong 1
300T/200T/160T/110T/80T Punching machine Taiwan, China 13
CNC V-cut machine Japan 2
E-testing machine Hong Kong 23
General E-testing machine Italy 2
Flying probe tester machine Germany 2
Vacuum Package machine Taiwan 3
Plot machine Switzerland 2
OSP line Taiwan 2
Vacuum Pressing machine Taiwan 2
X-Ray target drilling machine Taiwan 2
Brown Oxide line Hong Kong 1
Conveyor Oven Hong Kong 3
TDR Characteristic impedance machine special process to be handed outside of our facilities 1
Automatic Laminate machine Japan 2

Output capacity

PCB Monthly Output
2008 2009 2010
Double side 25,000m2 30,000m2 35,000m2
Multi-layer 15,000m2 30,000m2 35,000m2
Total 40,000m2 60,000m2 70,000m2
Flexible  PCB Monthly Output
2008 2009 20010
Single 10,000m2 800m2 12,000m2
Double Side & Multi-layer 5,000m2 10,000m2 12,000m2
Total 15,000m2 18,000m2 24,000m2

Production Capacity

Layer Counts: 1-14

Material: FR-4, High TG FR-4, PTFE, Aluminum Base, Rogers.

Maximum Size: 500mmX600mm

Board Outline Tolerance: ±0.13 mm

Board Thickness: 0.20mm—6.00mm

Thickness Tolerance (t=0.8mm): ±8%

Thickness Tolerance (t<0.8mm): ±10%

Insulation Layer Thickness: 0.075mm—5.00mm

Minimum Line: 0.2mm

Minimum Space: 0.2mm

Out-layer Copper Thickness: 35µm—175µm

In-layer Copper Thickness: 17µm-175µm

Drilling Hole (Mechanical): 0.15mm—6.35mm

Finish Hole (Mechanical): 0.15mm—6.30mm

Diameter Tolerance (Mechanical): 0.05mm

Registration (Mechanical): 0.075mm

Aspect Ratio: 8:1

Solder Mask Type: Ink

SMT Mini. Solder Mask Width: 0.08mm

Mini Solder Mask Clearance: 0.05mm

Plug Hole Diameter; 0.25mm—0. 60mm

Impedance Control Tolerance: ±10%

Surface Finish: HASL, ENIG, Chem, Tin, Flash Gold, OSP, Gold finger

2.

Application : Telecommunication, Network, Industrial control, Medical equipment, PC& periphery

3.

1) Characteristic: 0.5mm CSP

Blind & Buried Hole

Application : Blue tooth

2) Characteristic: up to 12 layer, Tg170℃

0.8mm BGA

±10% Impendance control

Application: Telecommunication, Network, Medical equipment, etc

3) Characteristic: Al-Base

Application: Power supply, Power Amplifier, relay, LED,etc

4) Characteristic: Up to 16 layer, Blind & Buried hole

Heavy copper 950z), Up to 6.0 mm board thickness

Application: Secondary Power source

  • HAVE QUESTIONS?

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  • Using major express couriers:

    Fast delivery time for prototypes (in normal working conditions):
     2 layers - 2/3 days
    4 layers - 4/5 days
    6 layers - 4/5 days
    8 layers - 6/7 days
    10 layers - 6/7 days
    12 layers - 8/9 days
    14 layers - 8/9 days

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